发明名称 SILICONE RESINS
摘要 <p>A silicone resin, curable to a resin of low coefficient of thermal expansion, high glass transition temperature and high modulus, has the empirical formula (R3SiO1/2)a(R2SiO2/2)b(RsiO3/2)c(SiO4/2)d wherein each R is a hydrocarbon or substituted hydrocarbon group or a hydrogen atom; and a = 0.02 to 0.8; b = 0 to 0.4; and c+d = 0.2 to 0.98, where a+b+c+d = 1.0, characterized in that at least 2 mole% of the siloxane units in the resin are of the formula R'3SiO1/2, RR'2Sio1/2 or R'2SiO2/2 wherein each R' is an alkenyl group.</p>
申请公布号 WO2004035661(A1) 申请公布日期 2004.04.29
申请号 WO2003EP11511 申请日期 2003.10.09
申请人 DOW CORNING CORPORATION;LEE, YEONG, JOO;CHEVALIER, PIERRE, MAURICE;OU, DUAN, LI;ROBSON, STEVEN;DUPONT, ANNE 发明人 LEE, YEONG, JOO;CHEVALIER, PIERRE, MAURICE;OU, DUAN, LI;ROBSON, STEVEN;DUPONT, ANNE
分类号 C08G77/20;C08L83/04;(IPC1-7):C08G77/20 主分类号 C08G77/20
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