| 发明名称 |
Process for simultaneously removing material on both sides of one or more semiconductor wafers comprises using a plate which has chemically inert abrasion- and adhesion-resistant coating in partial regions on the front and rear sides |
| 摘要 |
Process for simultaneously removing material on both sides of one or more semiconductor wafers comprises using a plate which has chemically inert abrasion- and adhesion-resistant coating in partial regions on the front and rear sides.
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| 申请公布号 |
DE10247200(A1) |
申请公布日期 |
2004.04.29 |
| 申请号 |
DE20021047200 |
申请日期 |
2002.10.10 |
| 申请人 |
WACKER SILTRONIC AG |
发明人 |
WENSKI, GUIDO;RIPPER, BERT;HEIER, GERHARD;BRAND, JOCHEN |
| 分类号 |
B24B37/04;B24B41/06;H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
B24B37/04 |
| 代理机构 |
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