WAVEGUIDE TYPE PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A waveguide type package and a manufacturing method thereof are provided to be capable of decreasing process time for reducing fabrication cost. CONSTITUTION: A waveguide type package is provided with an upper housing and a lower housing(300). At this time, the lower housing includes a pair of waveguides(310a,310b) for being inputted and outputted with an RF(Radio Frequency) signal and a semiconductor chip(350) loaded on its center portion between the pair of waveguides. At the time, the semiconductor chip includes an input strip part and an output strip part for transmitting the RF signal. The upper and lower housing are connected with each other. Preferably, a dummy PCB(Printed Circuit Board) is located between the semiconductor chip and the lower housing.