WAFER DEMOUNTING APPARATUS

摘要

PURPOSE: A wafer demounting apparatus is provided to be capable of preventing scratches from being generated at a wafer. CONSTITUTION: A wafer demounting apparatus is provided with a sliding plate(110) for inserting a wafer into a wafer cassette, a rotation joint installed at the lower portion of the sliding plate, and an anti-deviation rib(120) installed at both edge portions of the sliding plate for preventing the deviation of the wafer. At this time, a cutter(111) is formed at one end portion of the sliding plate for demounting the wafer fixed to a block. The wafer demounting apparatus further includes a deionized water jet part(130) installed at the lower portion of the sliding plate and a deionized water jet port(131) installed at the surface of the sliding plate and connected with the deionized water jet part for jetting deionized water onto the surface of the sliding plate.