发明名称 |
Mesoporous ceramic films having reduced dielectric constants |
摘要 |
<p>A process provides a ceramic film, such as a mesoporous silica film, on a substrate, such as a silicon wafer. The process includes preparing a film-forming fluid containing a ceramic precursor, a catalyst, a surfactant and a solvent, depositing the film-forming fluid on the substrate, and removing the solvent from the film-forming fluid on the substrate to produce the ceramic film on the substrate. The ceramic film has a dielectric constant below 2.3, a halide content of less than 1 ppm and a metal content of less than 500 ppm, making it useful for current and future microelectronics applications.</p> |
申请公布号 |
EP1123753(A3) |
申请公布日期 |
2004.04.28 |
申请号 |
EP20000126445 |
申请日期 |
2000.12.06 |
申请人 |
AIR PRODUCTS AND CHEMICALS, INC.;APPLIED MATERIALS, INC |
发明人 |
MACDOUGALL, JAMES EDWARD;HEIER, KEVIN R.;WEIGEL, SCOTT JEFFREY;WEDIMAN, TIMOTHY W.;DEMOS, ALEXANDROS T.;BEKIARIS, NIKOLAOS;LU, YUNFENG;MANDAL, ROBERT PARKASH;NAULT, MICHAEL P. |
分类号 |
C04B35/622;B05D5/12;C08F292/00;C08L53/00;C09D1/00;C09D153/00;C09D183/02;C09D185/00;H01B3/12;H01L21/312;H01L21/316;H05K3/46;(IPC1-7):H01L21/316 |
主分类号 |
C04B35/622 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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