| 摘要 |
PURPOSE: A wet chemical processing method and apparatus of silicon are provided to reduce processing cost by recycling partially oxynitride using a connection line. CONSTITUTION: An etchant(4) containing water, nitric acid, and hydrofluoric acid is activated by using oxynitride. The oxynitride is NO, NO2, N2O4, or a mixed compound thereof. The oxynitride is added to the etchant until the etchant is saturated. Wet chemical processing is performed on silicon in a first container(1) by using the activated etchant. The oxynitride is exhausted from the first container. The oxynitride is partially added to another etchant(5) of a second container(2) through a connection line(8).
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