Apparatus and method for scanning exposure

摘要

The apparatus measures positions of the wafer (4) in a direction along which pattern is to be focused by a projection system. The measured positions of the wafer are corrected by calculating the offsets. The wafer is moved during scanning exposure, based on the measured positions and the calculated offsets. Independent claims are also included for the following: (1) semiconductor device fabrication method; and (2) scanning exposure method.