发明名称 DEVICE FOR CONTROLLING TEMPERATURE OF MOLD
摘要 PURPOSE: A device for controlling the temperature of a mold is provided to easily heat the mold, and improve the quality of products by reducing the thermal deviation of the mold. CONSTITUTION: A device for controlling the temperature of a mold is composed of a boiler(10) for heating and supplying heat carriers, heating plates(20) having passages through which the heat carriers flow, the mold coupled to the heating plates, a supply pipe(40), and a collecting pipe. The heating plates are coupled to the lower part of an upper ram and the upper part of a bed, respectively. The heat carriers are fed from the boiler to the heating plates through the supply pipe. The heat carriers are fed from the heating plates to the boiler through the collecting pipe.
申请公布号 KR20040034661(A) 申请公布日期 2004.04.28
申请号 KR20040022138 申请日期 2004.03.31
申请人 HWANG, BAEK YONG 发明人 BOK, GWANG GYU;CHOI, JIN HYO;CHUN, MIN SIK;HWANG, BAEK YONG;JUNG, SANG IL;JUNG, SE YEONG;KIM, HAE JI;KIM, NAM GYEONG
分类号 B29C45/78;(IPC1-7):B29C45/78 主分类号 B29C45/78
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