| 发明名称 |
Method for making and packaging image sensor die using protective coating |
| 摘要 |
<p>A protective phenyl-resin layer (401) is formed over the image sensor die having micro-lenses (313) onto a semiconductor wafer (301). The wafer is diced to separate the image sensor die which is then mounted onto an integrated circuit package before removing the resin layer from the image senor die.</p> |
| 申请公布号 |
EP1414077(A2) |
申请公布日期 |
2004.04.28 |
| 申请号 |
EP20030256718 |
申请日期 |
2003.10.23 |
| 申请人 |
OMNIVISION INTERNATIONAL HOLDING LTD |
发明人 |
YAMAMOTO, KATSUMI |
| 分类号 |
H01L21/00;H01L21/44;H01L21/78;H01L27/146;H01L31/0203;(IPC1-7):H01L27/146;H01L31/020 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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