METHOD FOR MOUNTING EXTERNAL HEAT DISSIPATER TO LIGHT EMITTING DIODE TO INCREASE SIZE OF HEATING DISSIPATER

摘要

PURPOSE: A method for mounting external heat dissipater to LED(light emitting diode) is provided to increase the size of a heating dissipater portion. CONSTITUTION: A heat dissipating plate(121) is formed by pressing material(12) conveyed by a first conveyor(11) with a press(13). A LED(141) is conveyed from a diode conveyor(14). The LED(141) is picked up by a conveyor(15) and placed on the heat dissipating plate(121). The heat dissipating plate(121) is cut by a cutter(16) from the LED(141) formed on the material(12) to produce a final product(2). The final product(2) is packaged in a packaging unit(17). The material(12) in the cutting process is collected by a second conveyor(18).