发明名称 DRIVING SHAFT COOLING APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PURPOSE: A driving shaft cooling apparatus for manufacturing a semiconductor device is provided to be capable of effectively removing the heat generated from a driving shaft due to the reciprocating motion of the driving shaft. CONSTITUTION: A plurality of shafts are formed at a semiconductor device manufacturing apparatus. A driving shaft cooling apparatus for manufacturing a semiconductor device is provided with a cooling fan(100) for cooling the manufacturing apparatus using air and a coolant valve(108) installed at the opposition direction of the cooling fan for controlling the supply of coolant in order to cool the plurality of shafts. Preferably, the coolant valve supplies air or nitrogen gas. Preferably, the air or the nitrogen gas are supplied before a loading process of a semiconductor substrate or after an unloading process of the semiconductor substrate.
申请公布号 KR20040033777(A) 申请公布日期 2004.04.28
申请号 KR20020063029 申请日期 2002.10.16
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, TAE JIN
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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