DEFECT INSPECTION METHOD OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A defect inspection method of a semiconductor device is provided to be capable of improving the inspection efficiency of failure for a predetermined region except a cell region. CONSTITUTION: The image of the first position is stored as the first image(S100). At this time, the first position is located on the X-axis. The first image is compared with a predetermined image located on the X-axis(S110). Whether the first image is located at the cross point of the X-axis and Y-axis, or not, is decided(S120). When the first image is located at the X-axis alone, the first position is checked from a map(S150). Then, whether the first position is an end point, or not, is decided(S160). When the first image is located at the cross point, an image near the first image to the Y-axis is stored as the second image(S130). The second image is compared with a predetermined image located on the Y-axis(S140).