发明名称 Methods for the fabrication of electrical connectors
摘要 Methods for the fabrication of an array of electrical connectors are provided. A conductive layer is formed into an array of generally-shaped electrical contacts which are interconnected with original structural material. The relative positioning of the contacts is reinforced. The original structural material is then removed, and the array is attached to a substrate.
申请公布号 US6725536(B1) 申请公布日期 2004.04.27
申请号 US19990265906 申请日期 1999.03.10
申请人 MICRON TECHNOLOGY, INC. 发明人 AKRAM SALMAN;HEMBREE DAVID R.;FARNWORTH WARREN M.
分类号 G01R1/04;G01R31/26;H01L21/66;H01R13/24;H01R33/74;H01R43/00;H05K3/32;H05K7/10;(IPC1-7):H05K3/30 主分类号 G01R1/04
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