发明名称 |
Apparatus and methods for enhancing thermal performance of integrated circuit packages |
摘要 |
Novel methods and apparatus to enhance thermal performance of IC packages are disclosed. In an embodiment, a method of enhancing thermal uniformity across a semiconductor device is disclosed. The method includes providing the semiconductor device. The semiconductor device has a plurality of thermal regions. A first thermal region of the plurality of thermal regions has a different temperature than a second thermal region of the plurality of thermal regions. The method further provides a thermal enhancement material substantially adjacent to the first and second thermal regions. In another embodiment, a thermal conductivity of the thermal enhancement material is adjusted in relation to a temperature effecting the thermal enhancement material.
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申请公布号 |
US6727193(B2) |
申请公布日期 |
2004.04.27 |
申请号 |
US20020093669 |
申请日期 |
2002.03.08 |
申请人 |
SUN MICROSYSTEMS, INC. |
发明人 |
GEKTIN VADIM;MALLADI DEVIPRASAD |
分类号 |
H01L23/373;H01L23/433;H01L29/51;(IPC1-7):H01L21/26 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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