发明名称 Method for fabricating a memory structure having required scale spacers
摘要 A memory structure and the method for fabricating the same are disclosed in this present invention. A first gate structure and a second gate structure are provided onto a substrate. After an implanting process, the first gate structure will become the periphery device of an embedded memory structure, and the second gate structure will become the memory device of the embedded memory structure. A first spacer and a second spacer are fabricated on the sidewalls of the first gate structure and the second gate structure. After the formation of the contacts between the second gate structures, the second spacer on the sidewall of the second gate structure will be removed. Therefore, there is the dual spacer, including the first spacer and the second spacer, on the sidewall of the first gate structure. In the other hand, the single spacer, only the first spacer included, is left on the sidewall of the second gate structure. Therefore, this invention can fabricate the spacers in different scale based on the requirement of the semiconductor manufacture for the periphery device and the memory device.
申请公布号 US6727543(B2) 申请公布日期 2004.04.27
申请号 US20020286099 申请日期 2002.10.31
申请人 LIN YUNG-CHANG 发明人 LIN YUNG-CHANG
分类号 H01L21/302;H01L21/8234;H01L21/8239;H01L21/8242;H01L27/10;H01L27/105;H01L27/108;H01L29/76;(IPC1-7):H01L21/302 主分类号 H01L21/302
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