| 摘要 |
Methods and apparatus are disclosed for detecting manufacturing defects on unpopulated printed circuit boards under test (BUT) utilizing reliable single point current measurement. In a first set of preferred embodiments, an AC signal generator is connected to a signal plate placed under the BUT for applying an electrical field and thereby generating signals in conductors of the BUT. An array of pins mounted on an assembly on top of the BUT at fixed intervals samples currents from the test points on the BUT. In a second set of preferred embodiments, the AC signal generator is connected to the pin array, and the pins apply test signals into the conductive elements of the BUT at fixed intervals. The signal plate detects the electrical field on the BUT. The detected signals are analyzed to discern board faults.
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