发明名称 Semiconductor integrated circuit patterns
摘要 In a method of designing patterns of a semiconductor integrated circuit, the shape of each of a plurality of opening patterns formed by a plurality of contact holes is formed into a rectangular shape; and the contact holes are arranged in such a manner that a long side of each of the rectangular opening patterns is opposite to a long side of an adjacent rectangular opening pattern, and the positions of both ends of the long sides are trued up. Furthermore, a photomask is used for manufacturing a semiconductor integrated circuit as designed by the above method of designing patterns of a semiconductor integrated circuit, in which a plurality of rectangular opening patterns are provided thereon as a plurality of rectangular opening patterns for contact holes; and the a plurality of rectangular opening patterns are arranged in such a manner that adjacent long sides thereof are opposite to each other, and the position of both ends of each long side is trued up. Besides, a semiconductor device comprises a semiconductor integrated circuit designed by using a method of designing a semiconductor integrated circuit.
申请公布号 US6727026(B2) 申请公布日期 2004.04.27
申请号 US20010815004 申请日期 2001.03.23
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KUJI TATSUAKI;HASHIMOTO KOJI;USUI SATOSHI;NOJIMA SHIGEKI
分类号 G03F1/08;G03F1/14;G03F1/32;G03F1/36;G03F1/68;G06F17/50;H01L21/027;H01L23/522;(IPC1-7):G03F9/00;G03C5/00 主分类号 G03F1/08
代理机构 代理人
主权项
地址