| 发明名称 |
Semiconductor integrated circuit |
| 摘要 |
Bump areas for signals are spread on upper and lower positions with respect to Vdd and Vss lines in an I/O buffer. Thus, the direction of routing the lines from bumps for signals to the I/O buffers is spread in two directions. A greater number of I/O buffers can be accommodated without increasing the size of a semiconductor integrated circuit. |
| 申请公布号 |
US6727596(B2) |
申请公布日期 |
2004.04.27 |
| 申请号 |
US20010917883 |
申请日期 |
2001.07.31 |
| 申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
TAKABAYASHI TSUTOMU;MORIZANE SHIZUO |
| 分类号 |
H01L27/04;G11C7/10;H01L21/82;H01L21/822;H01L23/50;(IPC1-7):H01L23/48 |
主分类号 |
H01L27/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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