发明名称 |
End-point detection system for chemical mechanical polishing applications |
摘要 |
Chemical mechanical polishing systems and methods are disclosed. The system includes a polishing pad that is configured to move from a first point to a second point. A carrier is also included and is configured to hold a substrate to be polished over the polishing pad. The carrier is designed to apply the substrate to the polishing pad in a polish location that is between the first point and the second point. A first sensor is located at the first point and oriented so as to sense an IN temperature of the polishing pad, and a second sensor is located a the second point and oriented so as to sense an OUT temperature of the polishing pad. The sensing of the IN and OUT temperatures is configured to produce a temperature differential that allows monitoring the process state and the state of the wafer surface for purposes of switching the process steps while processing wafers by chemical mechanical planarization.
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申请公布号 |
US6726530(B2) |
申请公布日期 |
2004.04.27 |
申请号 |
US20020052769 |
申请日期 |
2002.01.17 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
MIKHAYLICH KATRINA A.;RAVKIN MIKE;GOTKIS YEHIEL |
分类号 |
B24B21/04;B24B37/04;B24B49/14;(IPC1-7):B24B49/14 |
主分类号 |
B24B21/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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