| 摘要 |
The heat sink of the present invention includes a device portion, a bend portion, and a support portion that thermally couples the circuit board component to a support member, thereby allowing for heat transfer from the circuit board component to the support member. The bend portion of the heat sink allows for displacement of the device portion relative to the support portion to limit the amount of stress generated by the heat sink on the circuit board component. The geometry of the heat sink further allows placement of the heat sink within the relatively narrow space conventionally formed between the circuit board and the support member.
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