发明名称 SEMICONDUCTOR DEVICE AND PACKAGE THEREOF
摘要 PROBLEM TO BE SOLVED: To secure an excellent photodetecting property by correcting curvature in the photodetecting surface of an optical device for the surface to maintain an appropriately curved plane or an appropriately flattened plane. SOLUTION: A bimetal 20 and a resistance heater 40 are integrated, and a plurality of such are arranged on the backside of a package body 10 having a built-in linear sensor. At an inspection step, for instance, the warp to occur in the photodetecting surface of the linear sensor at temperatures within an estimated range is detected, and the power level to be supplied to the resistance heaters 40 for the bimetals 20 to correct the warp is determined, and the result is registered in a controlling circuit. When the linear sensor is actually used, the resistance heaters 40 are heated by the controlling circuit for producing a curvature in the bimetals 20, and the curvature in the bimetals 20 in turn produces a curvature in the package body 10 for the photodetecting surface to have an appropriately curved plane or an appropriately flattened plane. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004127977(A) 申请公布日期 2004.04.22
申请号 JP20020285827 申请日期 2002.09.30
申请人 SONY CORP 发明人 KONDO TSUNENORI
分类号 H01L27/14;H01L23/34;H01L23/38;H01L31/02;H04N5/335;(IPC1-7):H01L27/14 主分类号 H01L27/14
代理机构 代理人
主权项
地址