| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To continuously perform the wide and extensive laser beam machining with the film machining range width of≥50 mm without generating any twists or wrinkles. <P>SOLUTION: In a laser beam machining method of a resin film for a circuit board, a long resin film as a work film 6 is carried, the carriage of the film is once stopped when an area to be machined is carried above a machining table 8, and the machining table is elevated to support the work film at a predetermined position, and moved at a right angle to the laser beam sweeping direction. Laser beams from one machining head fixed to the predetermined position are swept by a sweeping means in a single direction or in a two-way direction, and an area of 50-300 mm is irradiated in the sweeping width direction of the work film in one continuous sweeping of laser beams. <P>COPYRIGHT: (C)2004,JPO</p> |
