| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve reliability of a multi-chip semiconductor device laminating a plurality of chips including semiconductor chips having a connection plug formed in a through hole penetrating a semiconductor substrate. <P>SOLUTION: A semiconductor device is provided with the semiconductor substrate 11 integrating and forming a semiconductor element, a wiring layer 12 formed on the surface of the semiconductor substrate 11, and the connection plug 16 formed in the trough hole penetrating the semiconductor substrate 11 and having conductivity. The connection plug 16 having a smaller part with a parallel cross sectional area on the surface of the semiconductor substrate 11 than the areas of the upper face and the lower face of the connection plug 16. <P>COPYRIGHT: (C)2004,JPO |
