发明名称 PLASMA PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma processing apparatus for making work in an electrical discharge chamber easy and for making it possible to process uniformly matter to be processed. SOLUTION: In the plasma processing apparatus, a hermetically sealed plasma processing space is formed by using a base platform 21 and a cover member 22. The cover member 22 can contact and separate from the base platform 21. A gas supply port 24 is provided in a side of the cover member 22 and a gas exhaust port 25 in a side of the base platform 21. Thereby, gases flow uniformly on a surface of the matter to be processed, allowing more uniform plasma surface processing. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004128366(A) 申请公布日期 2004.04.22
申请号 JP20020293190 申请日期 2002.10.07
申请人 SAMCO INTERNATIONAL INC 发明人 TERAI HIROKAZU;HONJO ICHIHIRO;NISHIHARA YASUHIRO
分类号 C23C16/50;H01L21/205;H01L21/3065;(IPC1-7):H01L21/306 主分类号 C23C16/50
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