| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrode substrate and its manufacturing method by which finer-diameter and finer-pitch via-holes for mounting conductive members are formed in the substrate, and a larger and thinner substrate can be easily manufactured. SOLUTION: The electrode substrate 1 has a capillary substrate 3. The capillary substrate 3 includes a plurality of multi-channel members 5 having a plurality of via-holes 7. The multi-channel members 5 are integrally formed by being fused together in the state where the members are arranged in a two-dimensional form inside an edge member 9. The multi-channel members 5 are integrally formed by welding together of a plurality of hollowed glass members 11 having openings at their both ends, and shows a quadrangular shape as viewed in the perpendicular direction to the main surface of the capillary substrate 3. On the via-hole 7, a conductive member 13 comprising a first electrode 13a and a second electrode 13b is arranged. The first electrode 13a is formed on the inner wall of the via-hole 7, and the second electrode 13b is formed along the outer periphery of the opening of the via-hole 7 in the main surface of the capillary substrate 3. COPYRIGHT: (C)2004,JPO
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