发明名称 METHOD FOR MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board with less man-hours, wherein a resin paste is steadily printed on and fills up through holes along the inside of through-hole conductors. SOLUTION: In this method for manufacturing a wiring board, the wiring board 1 comprises a board main body 2 having a top surface 3, a rear surface 4, and a plurality of through-hole conductors 7, 7a penetrating through the top surface 3 and the rear surface 4 and having through holes 8, 8a inside. The rear surface 4 is mounted on a base board 10, and the parts of the through holes 8, 8a in the through-hole conductors 7, 7a in the rear side 4 are positioned in transverse holes (hollow sections) 12, 14 along the contour of the through holes 8, 8a in the base board 10. The method has a resin printing/filling process wherein a resin paste 29 is printed into the through holes 8, 8a from the side of the top surface 3 of the wiring board 1 by using a squeegee 26 for filling up the through holes 8, 8a with the resin paste 29. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004127992(A) 申请公布日期 2004.04.22
申请号 JP20020286174 申请日期 2002.09.30
申请人 NGK SPARK PLUG CO LTD 发明人 KASHIWAGI TETSUYA
分类号 H05K3/28;H05K3/42;(IPC1-7):H05K3/28 主分类号 H05K3/28
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