| 摘要 |
PROBLEM TO BE SOLVED: To provide a one-pack liquid epoxy resin composition exhibiting excellent hermeticity in a relay composed of a liquid crystal polymer (LCP), particularly excellent in adhesion to an LCP and to a metal terminal even at a high temperature at the time of a solder reflow treatment. SOLUTION: The one-pack liquid epoxy resin composition for sealing a small-sized relay comprises as essential ingredients an epoxy resin (A), a curing agent (B), a curing accelerator (C), and an inorganic filler (D), where the epoxy resin (A) comprises an epoxy resin (E) represented by general formula (I) or (II). COPYRIGHT: (C)2004,JPO
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