| 摘要 |
Method for handling microstructures, which comprises arranging them into one-dimensional, two-dimensional or three-dimensional arrays, and displacing them as such. The one-dimensional arrays are constituted by lines which may be straight or curved or constituted of different connected sections and the two-dimensional arrays are constituted by matrices. The microstructures may be liquid crystal display pixels; light-emitting diode display pixels; organic light emitting diode pixels; solar cell elements; electromagnetic signal detectors; plasma display pixels; integrated circuits. They can also be generated in wafers at regular distances from one another so as to form a matrix .The part itself could be shaped in the special form in order to fit the holes of a support or substrate to which they are to be connected. |
