THREE DIMENSIONAL LEAD INSPECTION SYSTEM

摘要

A semiconductor device lead inspection apparatus and method are provided for capturing images of the semiconductor edges and leads along two optical axes which have different directions in a plane perpendicular to the semiconductor device edge. A first image is reflected off an optical surface of a prism to a direction corresponding to the camera optical axis. A second image is reflected by two optical surfaces of the prism to a direction corresponding to the camera optial axis.