PLASMA PROCESSING APPARATUS, PROCESSING VESSEL USED IN PLASMA PROCESSING APPARATUS, DIELECTRIC PLATE USED IN PLASMA PROCESSING APPARATUS

摘要

Damage to a dielectric plate supporting unit and a metal vessel is kept to a minimum and the efficiency of plasma processing is improved. A resin layer is provided in a region where a dielectric plate and a processing vessel face each other. With this structure, particles and damage attributed to the difference of thermal expansion coefficients between the dielectric plate and the process vessel can be suppressed. In addition, local discharges at electric field boundaries such as edge portions of the dielectric plate are suppressed, thereby improving the efficiency of plasma processing such as formation of an oxide film.