| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photoresist composition and a method which are suitable for depositing a very thick photoresist layer in a single coating process. <P>SOLUTION: A volume mehtod which is generally concerned with a field of metal plating and specially for plating an electronic device with a metal bump such as a solder bump includes a process of depositing on a base a photosensitive composition which consists of a binder polymer with (met)acrylate units, a radical-polymerizable bridging agent, a light-activated component, and an organic solvent, is of ≥45% in solid concentration, and contains substantially no water and a process of rotating it at a high speed and for a long time enough to obtain a photosensitive layer with a uniform thickness of ≥50 microns. <P>COPYRIGHT: (C)2004,JPO |
