| 发明名称 |
Aluminum/ceramic bonding substrate and method for producing same |
| 摘要 |
An aluminum plate 12 having a purity of 99.5% or more, preferably 99.9% or more, is caused to contact at least one side of a ceramic substrate 10 of aluminum nitride or alumina to be heated at a temperature of 620 to 650° C. in an inert gas to bond the aluminum plate 12 directly to the ceramic substrate 10.
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| 申请公布号 |
US2004074951(A1) |
申请公布日期 |
2004.04.22 |
| 申请号 |
US20030673993 |
申请日期 |
2003.09.29 |
| 申请人 |
|
发明人 |
TAKAHASHI TAKAYUKI;OSANAI HIDEYO;NAMIOKA MAKOTO |
| 分类号 |
B32B15/04;B32B15/20;B32B18/00;C04B37/02;H01L23/36;H01L23/373;(IPC1-7):B23K31/02 |
主分类号 |
B32B15/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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