A SPUTTERING APPARATUS HAVING ENHANCED ADHESIVITY OF PARTICLES AND A MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a sputtering apparatus. A plurality of a circular or polygonal recesses (h) are formed in a surface of a shield (1-c';2-c') or a mask (2-d') in the sputtering apparatus. Accordingly, robust roots (R) made of particles that have adhered to the surface of the shield (1-c &cir& ; 2-c') or mask (2-d') rather than being directed to a deposited object are taken in the recesses of the shield or mask. Thus, it is possible to fundamentally exclude critical deposition defects occurring when the particles that have adhered to the surface of the shield (1-c'; 2-c') or the like are separated or peeled off from the surface.