| 发明名称 |
ELECTRONIC COMPONENT HAVING AT LEAST ONE SEMICONDUCTOR CHIP AND FLIP-CHIP CONTACTS, AND METHOD FOR THE PRODUCTION THEREOF |
| 摘要 |
The invention relates to an electronic component (1) having a semiconductor chip (2) and microscopically small flip-chip contacts of a rewiring plate (4) on which macroscopically large elastic outer contacts (5) are mounted. The rewiring plate (4) comprises a wiring support (6) made of polycrystalline silicon, amorphous glass or metal. The invention also relates to a method for producing a suitable wiring support (6) and the electronic component (1) itself. |
| 申请公布号 |
WO03085703(A3) |
申请公布日期 |
2004.04.22 |
| 申请号 |
WO2003DE01150 |
申请日期 |
2003.04.08 |
| 申请人 |
INFINEON TECHNOLOGIES AG;MEYER-BERG, GEORG;VASQUEZ, BARBARA |
发明人 |
MEYER-BERG, GEORG;VASQUEZ, BARBARA |
| 分类号 |
H01L21/00;H01L21/48;H01L21/60;H01L23/14;H01L23/15;H01L23/498;H01L23/50;H01L23/52;H01L25/065;H05K1/03;H05K3/40 |
主分类号 |
H01L21/00 |
| 代理机构 |
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