| 摘要 |
The aim of the invention is to provide a retaining ring for holding semiconductor wafers in a chemical-mechanical polishing device, whereby not only the edge effect, but also, inter alia, the time-intensive and cost-intensive replacement of the plastic element connected to the metallic ring by means of epoxy adhesive is avoided. To this end, the retaining ring is embodied as a single component and consists of a plastic material. Said retaining ring forms a supporting surface on a first front side, for placing the retaining ring on a polishing surface of the polishing device, and comprises assembly elements on the side opposing the first front side in the axial direction, by which means the retaining ring can be mounted in the polishing device. |
