SUPPORT FOR SUBSTRATES AND COMPOUND COMPRISING A SUPPORT SUBSTRATE AND AN EXTREMELY THIN SUBSTRATE

摘要

The invention relates to a compound comprising: - an extremely thin substrate that is provided with a thickness of < 0.3 mm and a top face and a bottom face; and - a support substrate having a top face and a bottom face. The extremely thin substrate is removably connected to the support substrate by means of a joining material that connects the top face of the extremely thin substrate and the top face of the support substrate and/or the edge region of the extremely thin substrate and the support substrate. Said compound is characterized by the fact that the joining material is temperature-resistant within the range of -75 DEG C to + 400 DEG C.