| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is subjected to resin sealing that is improved in mechanical strength and reliability, capable of avoiding a problem caused by insulating resin creeping up in a manufacturing process, and high in performance and quality, and to provide a method of manufacturing the same. <P>SOLUTION: An insulating resin 7 containing a resin repellence preventing agent that controls the wettability of the insulating resin is used, the insulating resin 7 is applied on a wiring board 20, and a semiconductor element 3 is mounted and pressed on the wiring board 20, whereby a resin fillet 11 is formed at the sides of the semiconductor element 3 with the insulating resin 7 extruded from below the semiconductor element 3 and the other insulating resin 7 located around the semiconductor element 3. <P>COPYRIGHT: (C)2004,JPO |
