| 摘要 |
A method and mounting assembly for mounting an electronic communication device having electronic circuitry to a surface is described, wherein the mounting assembly is associated with a back face of the electronic communication device. In a first preferred embodiment, the mounting assembly is a magnetic material associated with the back face of the electronic communication device. The magnetic material is magnetically influenced such that a magnetic field produced by the magnetic material emanates away from the back face of the electronic communication device. In an alternative first preferred embodiment, a synthetic resin laminate shield is intermediately placed between the back surface of the electronic communication device and the magnetic material for further insulating protection from the magnetic field of the magnetic material. In a second preferred embodiment, the back surface of the electronic communication device is provided with a repositionable adhesive. A silicone release layer is positioned on the repositionable adhesive for removal by the user and mounting of the electronic communication device on the surface.
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