SUBSTRATE TREATING APPRATUS

摘要

A substrate treating apparatus, comprising a reaction chamber (6) forming a space for treating a substrate (7), and a gas reserving part (10) connected to the reaction chamber (6), having a gas supply pipe for supplying gas for treating the substrate (7) and a gas exhaust pipe for exhausting the gas inside the reaction chamber (6) and reserving gas supplied to the reaction chamber (6), and reserving the gas to be supplied to the reaction chamber (6) midway in the gas supply pipe, and a bypass line (11) bypassing the gas reserving part (10), the gas receiving part (10) being arranged parallel with the bypass line, and a control part (60) supplying the treating gas to the reaction chamber (6) by using either of the gas reserving part (10) and the bypass line (11) when the substrate (7) is treated.