发明名称 Procedure to manufacture electrical component carrier having plastic housing with conductors stamped out of sheet metal with electronic components connected to them and all embedded in plastic of housing
摘要 Carrier is plastic housing (1) with embedded stamped conductors (2). Electronic components (4) are connected to conductors before plastic injection molding. Conductors are stamped from strips of sheet metal and components are crimped onto them. Conductor and connected component are stored on intermediate roll, fed to cutter which detaches conductor-component unit which is then fed to plastic injection molding station. Carrier is plastic housing (1) with embedded stamped conductors (2). Electronic components (4), e.g. resistors or diodes, are connected to conductors before plastic injection molding. Conductors are stamped from strips of sheet metal and components are crimped onto them. Conductor and connected component are stored on intermediate roll, fed to cutter which detaches conductor-component unit which is then fed to plastic injection molding station for complete covering in plastic. The connection (5) between the conductor (2) and the components (4) is achieved mechanically, by friction, or by crimping. The conductors are stored at an intermediate station as an endless web, fed to injection molding station where the connections between the components and the conductors are completely embedded in the housing wall. Independent claim included for 1) Carrier for electronic components for electric functioning units such as motor, plug, switch.
申请公布号 DE10247567(A1) 申请公布日期 2004.04.22
申请号 DE20021047567 申请日期 2002.10.11
申请人 WITTE-VELBERT GMBH & CO. KG 发明人 KOCH, MATTHIAS;VOGLER, MICHAEL;PTAK, MICHAEL
分类号 H02G1/04;H05K1/00;H05K1/18;H05K3/20;H05K3/32;(IPC1-7):H05K13/00;H05K7/02 主分类号 H02G1/04
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