| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for forming a film with a high conductor adhering property, abrasion resistant property and adhering property after thermal deterioration, while keeping mechanical property, heat resistant property, flexibility, and electrical insulation property necessary for an enamelled wire. SOLUTION: The resin composition includes (A) polyester imido resin having an isocyanurate ring in a molecular chain and (B) a tetrazole expressed by general formula (1) [R1=H, NH2, CH3, SH, Ar (aromatic ring), R2=H, CH3, Ar(aromatic ring)]. The enamelled wire is obtained by baking the resin composition applied on a conductor. COPYRIGHT: (C)2004,JPO
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