METHOD TO RECOVER SPENT COMPONENTS OF A SPUTTER TARGET

摘要

A method to recover components of a sputter target assembly having a target bonded onto a backing plate is described. The method includes hydriding the tantalum or niobium target to a tantalum hydride or niobium hydride, respectively and then separating the tantalum hydride or niobium hydride from the backing plate. Sputter targets are further described as well as subsequent process steps.