| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin precursor composition suitable for a surface protecting sheet of a semiconductor device, etc., and having excellent uniformity in coating. <P>SOLUTION: The photosensitive resin precursor composition is characterized by containing (a) a heat resistant resin precursor polymer, (b) a radiation sensitive compound and (c) a solvent represented by formulae (1) and/or (2). In the formula (1), R<SP>1</SP>is a 1 to 3C alkyl; R<SP>2</SP>to R<SP>5</SP>are each independently H or a 1 to 3C alkyl; and l is an integer of 0 to 3. In the formula (2), R<SP>6</SP>to R<SP>10</SP>are each independently H or a 1 to 3C alkyl; and j and k are each an integer of 0 to 3 with a proviso that j+k≥2. <P>COPYRIGHT: (C)2004,JPO |
