| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for peeling a protective tape, which can rapidly and surely peel the tape adhered to a work, such as a semiconductor chip bonded to a semiconductor package, a semiconductor wafer, etc. without damaging the surface of the work. SOLUTION: The method for peeling the protective tape includes the steps of first projecting to move an adhesive member is reciprocative manner movably constituted between an adhering position for adhering a peeling tape to the work and a standby position separate from the adhering position from the standby position to the work, and adhering the peeling tape to one end of the protective tape adhered to the work. Thereafter, the method further includes the steps of peeling the adhering member from the adhering position toward the standby position, thereafter winding the peeling tape and peeling the protective tape from the surface of the work. COPYRIGHT: (C)2004,JPO |
