| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and an electronic apparatus in which improvement in a shield effect for packaged components is attained. SOLUTION: The semiconductor device is composed of a module substrate 4 which has a front surface 4b and a rear surface 4c and in which a cavity 4a is formed on the rear surface 4c, a control chip 2 packaged on the front surface 4b of the module substrate 4, chip components 3 packaged on the front surface 4b adjacently with the control chip 2, an output chip 13 located within the cavity 4a on the rear surface 4c of the module substrate 4, a plurality of lands 1a provided on the rear surface 4c of the module substrate 4, and a seal 6 for sealing the control chip 2 and the plurality of chip components 3. The module substrate 4 is provided with a first GND pattern 4d electrically connected with a GND potential, such that electromagnetic shield is strengthened between the control chip 2 on the side of the front surface 4b and the output chip 13 on the side of the rear surface 4c. COPYRIGHT: (C)2004,JPO |
