| 摘要 |
PROBLEM TO BE SOLVED: To provide a BGA mounting structure of an automobile ECU wherein connection strength of a solder ball connection part and mass productivity are improved. SOLUTION: In a mounting structure of a ball grid array (BGA) which is mounted on a main board, the BGS is fixed by a claw part formed integrally with a frame of such shape as covers around the BGA. The frame is provided with at least one protruding part which is inserted in a hole provided on the main board, thus connecting the frame to the main board. The connection strength at the ball connection part of BGA heat radiation characteristics, and mass productivity are improved at mounting of the BGA without filling a resin. COPYRIGHT: (C)2004,JPO
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