发明名称 PLATING METHOD AND PLATING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a plating treatment technique capable of eliminating the stagnation of plating liquid flow near the outer periphery of a plating object surface which heretofore arises in the conventional jet flow type plating system without complicating the system structure. SOLUTION: The plating method comprises placing the plating object on an annular placing section disposed above the opening of a cup-shaped plating tank, supplying the plating liquid from a liquid supply port disposed at the bottom in the tank toward the plating object surface of the plating object, bringing the plating liquid into contact with the entire surface of the plating object surface, and performing plating while discharging the plating liquid from a plating liquid outtlet disposed in the lower position of the annular placing section. In the above method, the liquid outlet disposed in the lower position of the annular placing section is disposed in a position apart more to an outer side direction than the outer peripheral end of the plating object surface and the plating is performed in a way as to avoid the occurrence of the stagnation of the plating liquid flow near the outer periphery of the plating object surface. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004124138(A) 申请公布日期 2004.04.22
申请号 JP20020288195 申请日期 2002.10.01
申请人 ELECTROPLATING ENG OF JAPAN CO 发明人 UCHIUMI YUJI
分类号 C25D7/12;C25D5/08;C25D17/08;(IPC1-7):C25D7/12 主分类号 C25D7/12
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