| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for washing a substrate by which the substrate can sufficiently being washed while suppressing increase of roughness by only one washing time. SOLUTION: This method comprises steps of: treating the substrate with ozone water with a concentration of 15 ppm or higher (steps S21-S30), and treating the substrate with dilute hydrofluoric acid with a concentration of 0.1-10% (steps S21-S30). Contaminant on the film surface is eliminated and an oxidized film is formed as a protective film by ozone water. By using hydrofluoric acid, the oxidized film and metals on the surface of the substrate are eliminated. By using ozone water again, organic substance elimination, metal elimination and passivation (protective film forming and prevention of re-adhesion of contaminant) are performed. Only one time of washing by using ozone water with adequate concentration surely eliminates contaminant to suppress the increase of roughness. COPYRIGHT: (C)2004,JPO
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