| 摘要 |
A packaged semiconductor device has an integrated chip and a non-integrated chip. The integrated chip has an integrated circuit and first bump pads formed with a narrow pitch. The non-integrated chip has second bump pads formed so as to face the first bump pads, lead pads formed with a wide pitch (so as to permit connection thereto of wires), and wiring conductors electrically connecting these pads together. The two chips are connected together by way of bumps and are then sealed in resin. With this structure, it is possible to realize a low-cost packaged semiconductor device that can easily be mounted on a mother board.
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