发明名称 Hot-extrudable pressure-sensitive hot-melt adhesives and their use in multilayer films
摘要 The present invention relates to hot-coextrudable hot-melt pressure-sensitive adhesives particularly suitable for the production of multilayer films intended for what are called "repositionable" packages that are opened and reclosed easily. The films used in these packages comprise at least three layers, namely an outer layer intended to be complexed thereafter, a sealing and separable layer, defining all or part of the internal surface of the package, and between them a hot-melt adhesive layer that joins them together. In this type of package, the adhesive plays an essential role insofar as, once the package has been opened by the end user, the quality of the reclosure and of the reopening will depend on the performance of the adhesive, which is of course a pressure-sensitive adhesive, that is to say an adhesive that adheres simply by manual pressure.
申请公布号 US2004077759(A1) 申请公布日期 2004.04.22
申请号 US20030637539 申请日期 2003.12.10
申请人 BOSTIK FINDLEY, S.A. 发明人 BARDIOT ANNE;SAJOT NICOLAS;GERARD PIERRE;NOTTEAU CHRISTOPHE
分类号 B32B27/30;B32B7/12;B32B27/06;B65D77/20;C09J7/02;C09J11/06;C09J153/00;C09J153/02;C09J157/00;C09J193/04;C09J201/00;(IPC1-7):C08L9/00 主分类号 B32B27/30
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